Packaging Structure and Packaging Method for Antenna

ABSTRACT

The present disclosure provides a packaging structure and a packaging method for an antenna. The packaging structure comprises a redistribution layer, having a first surface and an opposite second surface; a first metal joint pin, formed on the second surface of the redistribution layer; a first packaging layer, disposed on the redistribution layer covering the first metal joint pin; a first antenna metal layer, patterned on the first packaging layer, and a portion of the first antenna metal layer electrically connects with the first metal joint pin; a second metal joint pin, formed on the first antenna metal layer; a second packaging layer, disposed on the first antenna metal layer covering the second metal joint pin; a second antenna metal layer, formed on the second packaging layer; and a metal bump and an antenna circuit chip, bonded to the first surface of the redistribution layer.

CROSS REFERENCES TO RELATED APPLICATIONS

This is the divisional application of U.S. patent application Ser. No.16/286,310, which claims the benefit of priority to U.S. patentapplication Ser. No. 16/286,310; entitled “Packaging Structure andPackaging Method for Antenna”, filed on Feb. 26, 2019, also claims thebenefit of priority to the Chinese Patent Application No.CN2018203598256, entitled “Packaging Structure for Antenna”, filed withCNIPA on Mar. 16, 2018, and the Chinese Patent Application No.CN2018102175884, entitled “Packaging Structure and Packaging Method forAntenna”, filed with CNIPA on Mar. 16, 2018, the contents of which areincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to the technical field of semiconductorpackaging, and in particular, to a packaging structure and packagingmethod for an IC antenna.

BACKGROUND

Various high-tech electronic products have been developed to bringconvenience to users, including various electronic devices such aslaptops, mobile phones, and portable Android devices (PAD), etc.

Increased demands for these popular high-tech electronic products haveenabled more functions and applications configured into these high-techproducts. In addition, to meet the need for mobilization, the functionof wireless communication is provided. Thus, users can access thehigh-tech electronic devices with the function of wireless communicationanywhere or any time. This greatly increases the flexibility andconvenience in use of these high-tech electronic products. Therefore,users no longer have to be confined to a certain area, and can enjoy theconvenience brought by these electronic products.

In general, existing antenna structures in IC devices usually have manytypes, for examples, they are dipole antenna, monopole antenna, patchantenna, planar inverted-F antenna, meander line antenna, inverted-Lantenna, loop antenna, spiral antenna and spring antenna. A knownpractice is to manufacture an antenna directly on the surface of acircuit board. By this practice, an antenna occupies an extra space ofthe circuit board, thereby resulting in a low integration level. Forvarious electronic devices, a large circuit board means a large size.However, the main purpose of designing and developing these electronicdevices is to allow users to carry them easily. Therefore, how to reducethe area of the circuit board occupied by an antenna, and improve theintegration performance of an antenna packaging structure is the key tosolve the problems of these electronic devices.

In addition, an existing antenna package is typically of a single-layerstructure with low antenna efficiency, which cannot meet the increasingdemand for antenna performance.

Based on the above, it is necessary to provide a packaging structure andpackaging method for an antenna with a high integration level and highefficiency.

SUMMARY

The present disclosure provides an IC antenna structure and packagingmethod for making the antenna.

The structure an IC antenna structure, comprising: a redistributionlayer having a first surface and an opposite second surface; a firstmetal joint pin, formed on the second surface of the redistributionlayer; a first packaging layer, disposed on the second surface of theredistribution layer covering the first metal joint pin, wherein the topsurface of the first metal joint pin is configured to be exposed fromthe first packaging layer; a first antenna metal layer, formed on thefirst packaging layer and configured to have a portion connectelectrically to the first metal joint pin; a second metal joint pin,formed on the portion of the first antenna metal layer connecting to thefirst metal joint pin; a second packaging layer, disposed on the firstantenna metal layer, covering the second metal joint pin, wherein thetop surface of the second metal joint pin is configured to be exposedfrom the second packaging layer; a second antenna metal layer, formed onthe second packaging layer, wherein a portion of the second antennametal layer connecting to the second metal joint pin; a metal bump,formed on the first surface of the redistribution layer; and an antennacircuit chip, bonded to the first surface of the redistribution layer.

Preferably, the first packaging layer is made from one of polyimide,silica gel and epoxy resin, and the second packaging layer is made fromone of polyimide, silica gel and epoxy resin.

Preferably, the redistribution layer comprises a patterned firstdielectric layer, a patterned first metal wiring layer, a patternedsecond dielectric layer and a patterned second metal wiring layer whichare sequentially stacked, and the first metal wiring layer iselectrically connected with the second metal wiring layer.

Further, the first dielectric layer and the second dielectric layer aremade from one or a combination of two or more of epoxy resin, silicagel, PI, PBO, BCB, silicon oxide, phosphorosilicate glass andfluorine-containing glass, and the first metal wiring layer and thesecond metal wiring layer are made from one or a combination of two ormore of copper, aluminum, nickel, gold, silver and titanium.

Preferably, the first metal joint pin and the second metal joint pin aremade from one of Au, Ag, Cu, and Al.

Preferably, the metal bump comprises one of tin solder, silver solderand gold-tin alloy solder.

Preferably, the packaging structure further comprises a bottom fillinglayer formed between the antenna circuit chip and the redistributionlayer to increase the bonding strength of the antenna circuit chip andthe redistribution layer and protect the redistribution layer.

Preferably, the second antenna metal layer protrudes from the surface ofthe second packaging layer.

Preferably, the second antenna metal layer sinks into the secondpackaging layer, so that the side face of the second antenna metal layeris covered by the second packaging layer.

The present disclosure further provides a method for fabricating anantenna, comprising the following steps: 1) providing a supportingsubstrate, and forming a separation layer on the supporting substrate;2) patterning a first antenna metal layer on the separation layer; 3)forming a first metal joint pin on the first antenna metal layer; 4)packaging the first antenna metal layer and the first metal joint pinwith a first packaging layer, and exposing a top surface of the firstmetal joint pin from a top surface of the first packaging layer; 5)patterning a second antenna metal layer on the surface of the firstpackaging layer, wherein a portion of the second antenna metal layer iselectrically connected with the first metal joint pin; 6) forming asecond metal joint pin on said portion of the second antenna metallayer; 7) packaging the second antenna metal layer and the second metaljoint pin with a second packaging layer, and exposing a top surface ofthe second metal joint pin from a top surface of the second packaginglayer; 8) forming a redistribution layer on the top surface of thesecond packaging layer, wherein the redistribution layer is electricallyconnected with the second metal joint pin; 9) forming a metal bump onthe redistribution layer; 10) providing an antenna circuit chip, andbonding the antenna circuit chip to the redistribution layer; and 11)separating the first packaging layer from the supporting substrate basedon the separation layer.

Preferably, the supporting substrate comprises one of a glass substrate,a metal substrate, a semiconductor substrate, a polymer substrate and aceramic substrate; the separation layer comprises a polymer layer, andthe polymer layer is first applied to the surface of the supportingsubstrate by a spin-coating process, and then cured by a UV curing orthermal curing process.

Preferably, the polymer layer comprises an LTHC photo-thermal conversionlayer, and the LTHC photo-thermal conversion layer is heated in step 11)by laser light, so that the first packaging layer and the supportingsubstrate are separated from each other at the LTHC photo-thermalconversion layer.

Preferably, the first metal joint pin is manufactured by a wire bondingprocess in step 3), the second metal joint pin is manufactured by a wirebonding process in step 6), the wire bonding process is one of a hotpress wire bonding process, an ultrasonic wire bonding process and a hotpress ultrasonic wire bonding process, and the first metal joint pin andthe second metal joint pin are made from one of Au, Ag, Cu and Al.

Preferably, step 4) of packaging the first antenna metal layer and thefirst metal joint pin with a first packaging layer adopts one of thefollowing methods: compression molding, transfer molding, liquid sealmolding, vacuum lamination and spin coating, and the second packaginglayer is made from one of polyimide, silica gel and epoxy resin; step 7)of packaging the second antenna metal layer and the second metal jointpin with a second packaging layer adopts one of the following methods:compression molding, transfer molding, liquid seal molding, vacuumlamination and spin coating, and the second packaging layer is made fromone of polyimide, silica gel and epoxy resin.

Preferably, step 8) of manufacturing the redistribution layer comprises:8-1) forming a first dielectric layer on the surface of the secondpackaging layer by a chemical vapor deposition process or a physicalvapor deposition process, and etching the first dielectric layer to forma patterned first dielectric layer; 8-2) forming a first metal layer onthe surface of the patterned first dielectric layer by a chemical vapordeposition process, an evaporation process, a sputtering process, anelectroplating process, or an electroless plating process, and etchingthe first metal layer to form a patterned first metal wiring layer,wherein the first metal wiring layer is electrically connected with thesecond metal joint pin; 8-3) forming a second dielectric layer on thesurface of the patterned first metal wiring layer by a chemical vapordeposition process or a physical vapor deposition process, and etchingthe dielectric layer to form a patterned second dielectric layer; 8-4)forming a second metal layer on the surface of the patterned seconddielectric layer by a chemical vapor deposition process, an evaporationprocess, a sputtering process, an electroplating process, or anelectroless plating process, and etching the second metal layer to forma patterned second metal wiring layer, wherein the second metal wiringlayer is electrically connected with the first metal wiring layer.

Preferably, the first dielectric layer and the second dielectric layerare made from one or a combination of two or more of epoxy resin, silicagel, PI, PBO, BCB, silicon oxide, phosphorosilicate glass andfluorine-containing glass, and the first metal wiring layer and thesecond metal wiring layer are made from one or a combination of two ormore of copper, aluminum, nickel, gold, silver and titanium.

Preferably, the metal bump comprises one of tin solder, silver solderand gold-tin alloy solder.

Preferably, between step 10) and step 11), the packaging method furthercomprises: forming a bottom filling layer between the antenna circuitchip and the redistribution layer to increase the bonding strength ofthe antenna circuit chip and the redistribution layer and protect theredistribution layer.

The present disclosure further provides a method for fabricating anantenna, comprising the steps of: 1) providing a supporting substrate,and forming a separation layer on the supporting substrate; 2) forming aredistribution layer on the separation layer, wherein the redistributionlayer has a first surface connected with the separation layer and anopposite second surface; 3) forming a first metal joint pin on thesecond surface of the redistribution layer; 4) packaging the first metaljoint pin and the redistribution layer with a first packaging layer, andexposing the first metal joint pin exposed from the top surface of thefirst packaging layer; 5) patterning a first antenna metal layer on thesurface of the first packaging layer, wherein a portion of the firstantenna metal layer is electrically connected with the first metal jointpin; 6) forming a second metal joint pin on the first antenna metallayer; 7) packaging the first antenna metal layer and the second metaljoint pin with a second packaging layer, and exposing a top of thesecond metal joint pin from a top surface of the second packaging layer;8) forming a second antenna metal layer on the surface of the secondpackaging layer; 9) separating the redistribution layer from thesupporting substrate based on the separation layer to expose the firstsurface of the redistribution layer; 10) forming a metal bump on thefirst surface of the redistribution layer; and 11) providing an antennacircuit chip, and bonding the antenna circuit chip to the first surfaceof the redistribution layer.

Preferably, the supporting substrate comprises one of a glass substrate,a metal substrate, a semiconductor substrate, a polymer substrate and aceramic substrate; the separation layer comprises a polymer layer, andthe polymer layer is first applied to the surface of the supportingsubstrate by a spin-coating process, and then cured by a UV curing orthermal curing process.

Preferably, the polymer layer comprises an LTHC photo-thermal conversionlayer, and the LTHC photo-thermal conversion layer is heated in step 9)by laser light, so that the second packaging layer and the supportingsubstrate are separated from each other at the LTHC photo-thermalconversion layer.

Preferably, step 2) of manufacturing the redistribution layer comprisesthe steps of 2-1) forming a first dielectric layer on the surface of theseparation layer by a chemical vapor deposition process or a physicalvapor deposition process, and etching the first dielectric layer to forma patterned first dielectric layer; 2-2) forming a first metal layer onthe surface of the patterned first dielectric layer by a chemical vapordeposition process, an evaporation process, a sputtering process, anelectroplating process, or an electroless plating process, and etchingthe first metal layer to form a patterned first metal wiring layer; 2-3)forming a second dielectric layer on the surface of the patterned firstmetal wiring layer by a chemical vapor deposition process or a physicalvapor deposition process, and etching the dielectric layer to form apatterned second dielectric layer; and 2-4) forming a second metal layeron the surface of the patterned second dielectric layer by a chemicalvapor deposition process, an evaporation process, a sputtering process,an electroplating process, or an electroless plating process, andetching the second metal layer to form a patterned second metal wiringlayer, wherein the second metal wiring layer is electrically connectedwith the first metal wiring layer.

Preferably, the first dielectric layer and the second dielectric layerare made from one or a combination of two or more of epoxy resin, silicagel, PI, PBO, BCB, silicon oxide, phosphorosilicate glass andfluorine-containing glass, and the first metal wiring layer and thesecond metal wiring layer are made from one or a combination of two ormore of copper, aluminum, nickel, gold, silver and titanium.

Preferably, the first metal joint pin is manufactured by a wire bondingprocess in step 3), the second metal joint pin is manufactured by a wirebonding process in step 6), the wire bonding process is one of a hotpress wire bonding process, an ultrasonic wire bonding process and a hotpress ultrasonic wire bonding process, and the first metal joint pin andthe second metal joint pin are made from one of Au, Ag, Cu and Al.

Preferably, step 4) of packaging the first metal joint pin and theredistribution layer with a first packaging layer adopts one of thefollowing methods: compression molding, transfer molding, liquid sealmolding, vacuum lamination and spin coating, and the second packaginglayer is made from one of polyimide, silica gel and epoxy resin; step 7)of packaging the first antenna metal layer and the second metal jointpin with a second packaging layer adopts one of the following methods:compression molding, transfer molding, liquid seal molding, vacuumlamination and spin coating, and the second packaging layer is made fromone of polyimide, silica gel and epoxy resin.

Preferably, the metal bump comprises one of tin solder, silver solderand gold-tin alloy solder.

Preferably, the packaging method further comprises step 12): forming abottom filling layer between the antenna circuit chip and theredistribution layer to increase the bonding strength of the antennacircuit chip and the redistribution layer and protect the redistributionlayer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 to FIG. 14 show the steps of fabricating an antenna package andsequential structural diagrams according to an embodiment in the presentdisclosure.

FIG. 15 to FIG. 27 show the steps of fabricating an antenna package andsequential structural diagrams according to another embodiment in thepresent disclosure.

FIG. 28 shows the structural diagram of an antenna package according tothe present disclosure.

DESCRIPTION OF REFERENCE NUMBERS

101 Supporting substrate 102 Separation layer 103 First Antenna metallayer 104 First Metal joint pin 105 First Packaging layer 106 SecondAntenna metal layer 107 Second Metal joint pin 108 Second Packaginglayer 109 Redistribution layer 110 Metal bump 111 Antenna circuit chip112 Bottom filling layer

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The embodiments of the present disclosure will be described below withreference to specific examples. Those skilled in the art can easilyunderstand other advantages and effects of the present disclosure by thecontents disclosed in the specification. The present disclosure can alsobe implemented or applied through other different specific embodiments.The details in the specification can also be based on differentviewpoints and applications, and various modifications or changes can bemade without departing from the spirit of the present disclosure.

Please refer to FIGS. 1-28. It should be noted that the illustrationprovided in the embodiments merely illustrates the basic idea of thepresent disclosure in a schematic manner, only the components related tothe present disclosure are shown in the illustration, the components arenot drawn in accordance with actual number, shape and dimension, theform, quantity and proportion of the components can be changed freely inactual implementation, and the layout pattern of the components may alsobe more complicated.

Embodiment 1

As shown in FIG. 28, the present embodiment provides a packagingstructure for an antenna. The packaging structure comprises aredistribution layer 109, a second metal joint pin 107, a secondpackaging layer 108, a second antenna metal layer 106, a first metaljoint pin 104, a first packaging layer 105, a first antenna metal layer103, a metal bump 110, an antenna circuit chip 111,and a bottom fillinglayer 112.

As shown in FIG. 28, the redistribution layer 109 has a first surfacefacing exterior and an opposite second surface facing interior of thechip.

As shown in FIG. 28, the redistribution layer 109 comprises a patternedfirst dielectric layer, a patterned first metal wiring layer, apatterned second dielectric layer and a patterned second metal wiringlayer which are sequentially stacked, wherein the first metal wiringlayer is electrically connected with the second metal wiring layer.Further, the first dielectric layer and the second dielectric layer aremade from one or a combination of two or more of epoxy resin, silicagel, PI, PBO, BCB, silicon oxide, phosphorosilicate glass andfluorine-containing glass, and the first metal wiring layer and thesecond metal wiring layer are made from one or a combination of two ormore of copper, aluminum, nickel, gold, silver and titanium.

As shown in FIG. 28, the second metal joint pin 107 is formed on thesecond surface of the redistribution layer 109, and is electricallyconnected with the redistribution layer 109.

The second metal joint pin 107 is made from a metal material like Au,Ag, Cu, and Al.

As shown in FIG. 28, the second packaging layer 108 covers the secondmetal joint pin 107 and the redistribution layer 109. Meanwhile, thesecond metal joint pin 107′s top surface is exposed.

The second packaging layer 108 is made from one of polyimide, silica geland epoxy resin. The top surface of the second packaging layer 108 is agrounded or polished flat surface, to improve the quality of the secondantenna metal layer 106.

As shown in FIG. 28, the second antenna metal layer 106 is formed on thesecond packaging layer 108, and the second antenna metal layer 106 iselectrically connected with the second metal joint pin 107.

The material of the second antenna metal layer 106 may be Au, or Cu,etc. The second antenna metal layer 106 may have various differentpatterns according to performance requirements.

As shown in FIG. 28, the second metal joint pin 107 is formed on thesecond antenna metal layer 106.

The second metal joint pin 107 is made from one of Au, Ag, Cu, and Al.

As shown in FIG. 28, the first packaging layer 105 covers the secondantenna metal layer 106, and exposes the second metal joint pin 107, andthe second metal joint pin 107 the top surface of the first packaginglayer 105.

The first packaging layer 105 is made from one of polyimide, silica geland epoxy resin. The top surface of the first packaging layer 105 is aground or polished flat surface, so as to improve the quality of thefirst antenna metal layer 103.

As shown in FIG. 28, the first antenna metal layer 103 is formed on thefirst packaging layer 105, and the first antenna metal layer 103protrudes from the surface of the first packaging layer 105. The secondantenna metal layer 106 may be made from Au, Cu, etc., and the secondantenna metal layer 106 may have various different patterns according toperformance requirements.

As shown in FIG. 28, the metal bump 110 is formed on the first surfaceof the redistribution layer 109. The metal bump 110 comprises a soldermaterial like f tin solder, silver solder and gold-tin alloy solder.

As shown in FIG. 28, the antenna circuit chip 111 is bonded to the firstsurface of the redistribution layer 109, and the antenna circuit chip111 is electrically connected with the second antenna metal layer 106and the first antenna metal layer 103 through the redistribution layer109, the second metal joint pin 107 and the first metal joint pin 104,so as to realize the functions of the antenna. Based on the structure,an antenna packaging structure with more layers can be realized by moremetal joint pins, packaging layers and antenna metal layers.

As shown in FIG. 28, the packaging structure further comprises a bottomfilling layer 112 filled between the antenna circuit chip 111 and theredistribution layer 109 to increase the bonding strength of the antennacircuit chip 111 to the redistribution layer 109 and protect theredistribution layer 109.

As shown in FIG. 15 to FIG. 28, the embodiment further provides apackaging method for an antenna, comprising the following steps:

Step 1), providing a supporting substrate 101, and forming a separationlayer 102 on the supporting substrate 101as shown in FIG. 15.

As an example, the supporting substrate 101 may be one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate and a ceramic substrate. In the present embodiment, thesupporting substrate 101 is a glass substrate, the cost of the glasssubstrate is lower than other types, it is easy to form the separationlayer 102 on the surface of the glass substrate, and so it is easier forthe subsequent separation process.

As an example, the separation layer 102 may be an adhesive tape or apolymer layer. In the case of a polymer layer, the polymer is firstapplied to the surface of the supporting substrate 101 by a spin-coatingprocess, and then cured by a UV curing or thermal curing process.

In the present embodiment, the polymer layer comprises an LTHCphoto-thermal conversion layer, and the LTHC photo-thermal conversionlayer can be heated later in step 9) by laser light, so that asubsequently formed packaging layer 105 and the supporting substrate 101are separated from each other at the LTHC photo-thermal conversionlayer.

Step 2), forming a redistribution layer 109 on the separation layer 102,wherein the redistribution layer 109 comprises a first surface connectedwith the separation layer 102 and an opposite second surface, as shownin FIG. 16.

Forming the redistribution layer 109 of step 2) comprises the followingsteps:

step 2-1), forming a first dielectric layer as part of 109 on thesurface of the separation layer 102 by a chemical vapor depositionprocess or a physical vapor deposition process, and etching the firstdielectric layer to form a patterned first dielectric layer, wherein thefirst dielectric layer is made from one or a combination of two or moreof epoxy resin, silica gel, PI, PBO, BCB, silicon oxide,phosphorosilicate glass and fluorine-containing glass;

step 2-2) forming a first metal layer (not shown) on the surface of thepatterned first dielectric layer by a chemical vapor deposition process,an evaporation process, a sputtering process, an electroplating process,or an electroless plating process, and etching the first metal layer toform a patterned first metal wiring layer, wherein the first metalwiring layer is made from one or a combination of two or more of copper,aluminum, nickel, gold, silver and titanium;

step 2-3) forming a second dielectric layer on the surface of thepatterned first metal wiring layer by a chemical vapor depositionprocess or a physical vapor deposition process, and etching thedielectric layer to form a patterned second dielectric layer, whereinthe second dielectric layer is made from one or a combination of two ormore of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide,phosphorosilicate glass and fluorine-containing glass; and

step 2-4) forming a second metal layer on the surface of the patternedsecond dielectric layer by a chemical vapor deposition process, anevaporation process, a sputtering process, an electroplating process, oran electroless plating process, and etching the second metal layer toform a patterned second metal wiring layer, wherein the second metalwiring layer is electrically connected with the first metal wiringlayer. The second metal wiring layer is made from one or a combinationof two or more of copper, aluminum, nickel, gold, silver, and titanium.

Step 3), forming a second metal joint pin 107 on the second surface ofthe redistribution layer 109, as shown in FIG. 17.

In step 3), the second metal joint pin 107 is manufactured by a wirebonding process, wherein the wire bonding process comprises one of a hotpress wire bonding process, an ultrasonic wire bonding process and a hotpress ultrasonic wire bonding process, and the second metal joint pin107 is made from one of Au, Ag, Cu and Al.

Step 4), packaging the second metal joint pin 107 and the redistributionlayer 109 with a packaging layer 108, and then grinding the secondpackaging layer 108 until the second metal joint pin 107 is exposed fromthe top surface of the second packaging layer 108, as shown in FIG. 18to FIG. 19.

Packaging the second metal joint pin 107 and the redistribution layer109 with the second packaging layer 108in step 4) adopts one of thefollowing methods: compression molding, transfer molding, liquid sealmolding, vacuum lamination and spin coating, and the second packaginglayer 108 is made from one of polyimide, silica gel and epoxy resin.

Step 5), forming a second antenna metal layer 106 on the surface of thesecond packaging layer 108, wherein the second antenna metal layer 106is electrically connected with the second metal joint pin 107, as shownin FIG. 20.

For example, a metal layer may be formed on the surface of the secondpackaging layer 108 by evaporation or sputtering, and then the metallayer is patterned to form the second antenna metal layer 106 by anetching process. Optionally, the second antenna metal layer 106 may alsobe formed by a metal lift-off process, that is, forming a photoresistpattern on the surface of the second packaging layer 108 first, thenforming a metal layer on the photoresist pattern by an evaporation orsputtering method, and finally removing the photoresist pattern andseparating the metal layer from the photoresist pattern, with thepatterned antenna metal layer 106 left on the surface of the secondpackaging layer 108.

Step 6), forming a first metal joint pin 104 on the second antenna metallayer 106, as shown in FIG. 21.

In step 6), the first metal joint pin 104 is manufactured by a wirebonding process, wherein the wire bonding process is one of a hot presswire bonding process, an ultrasonic wire bonding process and a hot pressultrasonic wire bonding process, and the first metal joint pin 104 ismade from one of Au, Ag, Cu and Al.

Step 7), packaging the second antenna metal layer 106 and the firstmetal joint pin 104 with a packaging layer 105, and then grinding thefirst packaging layer 105 until the first metal joint pin 104 is exposedfrom the top surface of the first packaging layer 105, as shown in FIG.22 to FIG. 23.

Step 7) of packaging the second antenna metal layer 106 and the firstmetal joint pin 104 with a packaging layer 105 adopts one of thefollowing methods: compression molding, transfer molding, liquid sealmolding, vacuum lamination and spin coating, and the first packaginglayer 105 is made from one of polyimide, silica gel and epoxy resin.

Step 8), forming an antenna metal layer 103 on the surface of the firstpackaging layer 105, as shown in FIG. 24.

For example, a metal layer may be formed on the surface of the firstpackaging layer 105 by an evaporation or sputtering method first, andthe metal layer is patterned to form the first antenna metal layer 103by an etching process. Of course, the first antenna metal layer 103 mayalso be formed by a metal lift-off process, that is, forming aphotoresist pattern on the surface of the first packaging layer 105first, then forming a metal layer on the photoresist pattern by anevaporation or sputtering method, and finally removing the photoresistpattern and separating the metal layer from the photoresist pattern,with the patterned antenna metal layer 103 left on the surface of thefirst packaging layer 105.

Step 9), separating the redistribution layer 109 from the supportingsubstrate 101 based on the separation layer 102 to expose the firstsurface of the redistribution layer 109, as shown in FIG. 25.

For example, the LTHC photo-thermal conversion layer is heated by laserlight, so that the subsequently formed packaging layer 105 and thesupporting substrate 101 are separated from each other at the LTHCphoto-thermal conversion layer.

Step 10), forming a metal bump 110 on the first surface of theredistribution layer 109, as shown in FIG. 26.

The metal bump 110 comprises one of tin solder, silver solder andgold-tin alloy solder.

Step 11) and step 12) providing an antenna circuit chip 111, bonding theantenna circuit chip 111 to the first surface of the redistributionlayer 109, and finally forming a bottom filling layer 112 between theantenna circuit chip 111 and the redistribution layer 109 to increasethe bonding strength of the antenna circuit chip 111 and theredistribution layer 109 and protect the redistribution layer 109, asshown in FIG. 27 to FIG. 28.

Embodiment 2

As shown in FIG. 1 to FIG. 14, the present embodiment provides apackaging method for an antenna, comprising the following steps:

Step 1), providing a supporting substrate 101, and forming a separationlayer 102 on the supporting substrate 101, as shown in FIG. 1.

As an example, the supporting substrate 101 comprises one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate and a ceramic substrate. In the present embodiment, thesupporting substrate 101 is a glass substrate, the cost of the glasssubstrate is low, it is easy to form the separation layer 102 on thesurface of the glass substrate, and the difficulty of the subsequentseparation process can be reduced.

As an example, the separation layer 102 comprises one of an adhesivetape and a polymer layer. The polymer layer is first applied to thesurface of the supporting substrate 101 by a spin-coating process, andthen cured by a UV curing or thermal curing process.

The polymer layer comprises an LTHC photo-thermal conversion layer, andthe LTHC photo-thermal conversion layer can be heated later in step 11)by laser light, so that the first packaging layer 105 and the supportingsubstrate 101 are separated from each other at the LTHC photo-thermalconversion layer.

Step 2), forming an antenna metal layer 103 on the separation layer 102,as shown in FIG. 2.

For example, a metal layer may be formed on the surface of theseparation layer 102 by an evaporation or sputtering method first, andthen the metal layer is patterned form the first antenna metal layer 103by an etching process. Optionally, the first antenna metal layer 103 mayalso be formed by a metal lift-off process, that is, forming aphotoresist pattern on the surface of the separation layer 102 first,then forming a metal layer on the photoresist pattern by an evaporationor sputtering method, and finally removing the photoresist pattern andseparating the metal layer from the photoresist pattern, with thepatterned antenna metal layer 103 left on the surface of the separationlayer 102.

Step 3), forming a first metal joint pin 104 on the first antenna metallayer 103, as shown in FIG. 3.

The first metal joint pin 104 is manufactured by a wire bonding process,wherein the wire bonding process is one of a hot press wire bondingprocess, an ultrasonic wire bonding process and a hot press ultrasonicwire bonding process, and the first metal joint pin 104 is made from oneof Au, Ag, Cu, and Al.

Step 4), packaging the first antenna metal layer 103 and the first metaljoint pin 104 with a packaging layer 105, so that the first metal jointpin 104 is exposed from the top surface of the first packaging layer105, as shown in FIG. 4 to FIG. 5.

The packaging of the first antenna metal layer 103 and the first metaljoint pin 104 with a packaging layer 105 adopts one of the followingmethods: compression molding, transfer molding, liquid seal molding,vacuum lamination and spin coating, and the first packaging layer 105 ismade from one of polyimide, silica gel and epoxy resin.

Step 5), forming an antenna metal layer 106 on the surface of the firstpackaging layer 105, wherein the second antenna metal layer 106 iselectrically connected with the first metal joint pin 104, as shown inFIG. 6.

Step 6), forming a second metal joint pin 107 on the second antennametal layer 106, as shown in FIG. 7.

The second metal joint pin 107 is manufactured by a wire bondingprocess, wherein the wire bonding process is one of a hot press wirebonding process, an ultrasonic wire bonding process and a hot pressultrasonic wire bonding process, and the first metal joint pin 107 andsecond metal joint pin 107 are made from one of Au, Ag, Cu and Al.

Step 7), packaging the second antenna metal layer 106 and second metaljoint pin 107 with a packaging layer 108, so that second metal joint pin107 is exposed from the top surface of the second packaging layer 108,as shown in FIG. 8 to FIG. 9.

The packaging of the second antenna metal layer 106 and second metaljoint pin 107 with a packaging layer 108 adopts one of the followingmethods: compression molding, transfer molding, liquid seal molding,vacuum lamination and spin coating, and the second packaging layer 108is made from one of polyimide, silica gel and epoxy resin.

Step 8), forming a redistribution layer 109 on the surface of the secondpackaging layer 108, wherein the redistribution layer 109 iselectrically connected with second metal joint pin 107, As shown in FIG.10.

Step 8) of forming the redistribution layer 109 comprises the followingsteps:

8-1), forming a first dielectric layer on the surface of the secondpackaging layer 108 by a chemical vapor deposition process or a physicalvapor deposition process, and etching the first dielectric layer to forma patterned first dielectric layer;

8-2) forming a first metal layer on the surface of the patterned firstdielectric layer by a chemical vapor deposition process, an evaporationprocess, a sputtering process, an electroplating process, or anelectroless plating process, and etching the first metal layer to form apatterned first metal wiring layer, wherein the first metal wiring layeris electrically connected with second metal joint pin 107;

8-3) forming a second dielectric layer on the surface of the patternedfirst metal wiring layer by a chemical vapor deposition process or aphysical vapor deposition process, and etching the dielectric layer toform a patterned second dielectric layer; and

8-4) forming a second metal layer on the surface of the patterned seconddielectric layer by a chemical vapor deposition process, an evaporationprocess, a sputtering process, an electroplating process, or anelectroless plating process, and etching the second metal layer to forma patterned second metal wiring layer, wherein the second metal wiringlayer is electrically connected with the first metal wiring layer.

The first dielectric layer and the second dielectric layer are made fromone or a combination of two or more of epoxy resin, silica gel, PI, PBO,BCB, silicon oxide, phosphorosilicate glass and fluorine-containingglass, and the first metal wiring layer and the second metal wiringlayer are made from one or a combination of two or more of copper,aluminum, nickel, gold, silver and titanium.

Step 9), forming a metal bump 110 on the redistribution layer 109, asshown in FIG. 11.

The metal bump 110 comprises one of tin solder, silver solder andgold-tin alloy solder.

Step 10), providing an antenna circuit chip 111, and bonding the antennacircuit chip 111 to the redistribution layer 109,as shown in FIG. 12.

Between step 10) and step 11), the packaging method further comprises:forming a bottom filling layer 112 between the antenna circuit chip 111and the redistribution layer 109 to increase the bonding strength of theantenna circuit chip 111 and the redistribution layer 109 and protectthe redistribution layer 109.

Step 11), separating the first packaging layer 105 from the supportingsubstrate 101 based on the separation layer 102,as shown in FIG. 13 toFIG. 14.

As shown in FIG. 14, the present embodiment further provides a packagingstructure for an antenna. The basic structure is the same as that ofembodiment 1, and the main difference from embodiment 1 lies in that thefirst antenna metal layer 103 of the packaging structure sinks into thefirst packaging layer 105, such that the side face of the first antennametal layer 103 is covered by the first packaging layer 105, which cangreatly improve the mechanical stability of the first antenna metallayer 103 and improve the overall performance of the packagingstructure.

The disclosed device have the following benefits:

the packaging structure for an antenna according to the presentdisclosure adopts the redistribution layer to realize the integration oftwo or more antenna metal layers, greatly improving the efficiency andperformance of the antenna, and the packaging structure and packagingmethod for an antenna according to the present disclosure have a highintegration level; and

in the present disclosure, a fan-out packaging method is adopted topackage the antenna, which can effectively reduce the packaging volume,and make the packaging structure for an antenna have a high integrationlevel and better packaging performance, thereby having a wideapplication prospect in the field of semiconductor packaging.

Therefore, the present disclosure effectively overcomes variousdisadvantages in the prior art and has high industrial utilizationvalue.

The above-described embodiments merely illustrate the principles andeffects of the present disclosure, but are not intended to limit thepresent disclosure. Any person skilled in the art can modify or changethe above embodiments without departing from the spirit and scope of thepresent disclosure. Therefore, all equivalent modifications or changesmade by persons of ordinary skill in the art without departing from thespirit and technical thought disclosed in the present disclosure shallstill be covered by the claims of the present disclosure.

What is claimed is:
 1. An IC antenna structure, comprising: a supportingsubstrate having a separation layer on a first surface of the supportingsubstrate a first antenna metal layer disposed on the separation layerover the first surface of the supporting substrate; a first metal jointpin disposed on the first antenna metal layer over the first surface ofthe supporting substrate, a first packaging layer disposed over thefirst surface of the supporting substrate, and a top surface of thefirst metal joint pin is exposed from a top surface of the firstpackaging layer; a second antenna metal layer disposed on the topsurface of the first packaging layer, wherein a portion of the secondantenna metal layer is electrically connected with the first metal jointpin; a second metal joint pin disposed on said portion of the secondantenna metal layer over the first surface of the supporting substrate,wherein the second antenna metal layer and the second metal joint pinare packaged with a second packaging layer, and wherein a top surface ofthe second metal joint pin is exposed from a top surface of the secondpackaging layer; a redistribution layer formed on the top surface of thesecond packaging layer over the first surface of the supportingsubstrate, wherein the redistribution layer is above the first and thesecond metal joint pins and is electrically connected with the secondmetal joint pin; a metal bump formed on the redistribution layer overthe first surface of the supporting substrate; and an antenna circuitchip bonded on the redistribution layer next to the metal bump over thefirst surface of the supporting substrate.
 2. The IC antenna structureaccording to claim 1, wherein the first packaging layer is selected fromone of polyimide, silica gel and epoxy resin, and the second packaginglayer is made from one of polyimide, silica gel and epoxy resin.
 3. TheIC antenna structure according to claim 1, wherein the redistributionlayer is formed of a stack comprising a patterned first dielectriclayer, a patterned first metal wiring layer, a patterned seconddielectric layer and a patterned second metal wiring layer, and whereinthe patterned first metal wiring layer is electrically connected withthe patterned second metal wiring layer.
 4. The IC antenna structureaccording to claim 3, wherein the first dielectric layer and the seconddielectric layer are made from one or a combination of two or more ofepoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphorosilicateglass and fluorine-containing glass, and the patterned first metalwiring layer and the patterned second metal wiring layer are made fromone or a combination of two or more of copper, aluminum, nickel, gold,silver and titanium.
 5. The IC antenna structure according to claim 1,wherein the first metal joint pin and the second metal joint pin aremade from one of Au, Ag, Cu, and Al.
 6. The IC antenna structureaccording to claim 1, wherein the metal bump comprises one of tinsolder, silver solder and gold-tin alloy solder.
 7. The IC antennastructure according to claim 1, further comprising a bottom fillinglayer formed between the antenna circuit chip and the redistributionlayer to increase the bonding strength of the antenna circuit chip andthe redistribution layer and protect the redistribution layer.
 8. The ICantenna structure according to claim 1, wherein the second antenna metallayer protrudes from a surface of the second packaging layer.
 9. The ICantenna structure according to claim 1, wherein the second antenna metallayer is recessed into the second packaging layer, so that a side faceof the second antenna metal layer is embedded in the second packaginglayer.